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SZMMSZ4689T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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SZMMSZ4689T1G - onsemi - PCB symbol
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PCB Footprints
SZMMSZ4689T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - MMSZ5240BT1
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SZMMSZ4689T1G - onsemi - 3D model - Small Outline Diode - MMSZ5240BT1
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SZMMSZ4689T1G Details

  • Manufacturer Part Number:

    SZMMSZ4689T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

SZMMSZ4689T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for heat dissipation. A copper pour on the PCB with multiple vias to a solid ground plane can help to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermally conductive material for the PCB substrate.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow the recommended PCB layout guidelines for ESD protection.
  • Yes, the SZMMSZ4689T1G is qualified for automotive and high-reliability applications. However, ensure that the device is used within the recommended operating conditions and that the PCB is designed to meet the required reliability standards.
  • Follow the recommended soldering temperature profile: 260°C (peak temperature), 10-30 seconds (dwell time), and 150-200°C (soldering iron temperature). Use a solder with a melting point above 217°C.

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SZMMSZ4689T1G Overview

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