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SZMMSZ4708T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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PCB Footprints
SZMMSZ4708T1G - onsemi PCB footprint - Small Outline Diode - Small Outline Diode - SOD-123
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3D Models
SZMMSZ4708T1G - onsemi  - 3D model - Small Outline Diode - SOD-123
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SZMMSZ4708T1G Details

  • Manufacturer Part Number:

    SZMMSZ4708T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123

  • Package Description:

    SOD-123, 2 PIN

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    22 V

  • Reverse Current-Max:

    0.01 µA

  • Reverse Test Voltage:

    16.7 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    0.05 mA

SZMMSZ4708T1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a 2-3 layer PCB with a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots on the PCB.
  • The SZMMSZ4708T1G has built-in ESD protection, but it's still important to follow standard ESD handling precautions when handling the device. This includes using an ESD wrist strap, ESD mat, or ESD bag to prevent static damage. It's also recommended to avoid touching the device's pins or handling it in a way that could generate static electricity.
  • The SZMMSZ4708T1G is a commercial-grade device, but onsemi does offer automotive-grade and high-reliability versions of similar devices. It's recommended to consult with onsemi's sales team or application engineers to determine the best device for your specific application and requirements.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure that the device is being used within its recommended operating conditions. Check for any signs of physical damage, overheating, or electrical overstress. Use oscilloscopes or logic analyzers to monitor the device's inputs and outputs, and consult with onsemi's application engineers or technical support team for further assistance.

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