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SZMMSZ4V3T1G - onsemi

Description: 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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SZMMSZ4V3T1G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SOD-123 CASE 425-04 ISSUE G
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SZMMSZ4V3T1G - onsemi  - 3D model - Diodes Moulded - SOD-123 CASE 425-04 ISSUE G
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SZMMSZ4V3T1G Details

  • Manufacturer Part Number:

    SZMMSZ4V3T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 2 LEAD

  • Package Description:

    SOD-123, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    425-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.65

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    90 Ω

  • JESD-30 Code:

    R-PDSO-G2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    600 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    4.3 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    1 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

SZMMSZ4V3T1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, using thermal vias and a solid ground plane can also improve thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid thermal hotspots.
  • The SZMMSZ4V3T1G has built-in ESD protection, but it's still important to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap, mat, or packaging materials, and avoid touching the device's pins or exposed die. Ground the device to a common point during handling and assembly.
  • The SZMMSZ4V3T1G is a commercial-grade device, but onsemi offers other versions with enhanced reliability and automotive-grade options. For high-reliability or automotive applications, consider using the SZMMSZ4V3T1G-HR or SZMMSZ4V3T1G-AEC, which have undergone additional testing and qualification.
  • The optimal gate resistor value depends on the specific application, switching frequency, and gate drive voltage. A general guideline is to use a value between 10 ohms and 100 ohms. However, it's recommended to consult the application note or onsemi's support resources for more detailed guidance and simulation tools to determine the optimal value for your specific design.

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