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SZNUD3112DMT1G - onsemi

Description: Obsolete - Relay Driver, 12 V

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PCB Footprints
SZNUD3112DMT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-74 CASE 318F-05 ISSUE N
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3D Models
SZNUD3112DMT1G - onsemi  - 3D model - SOT23 (6-Pin) - SC-74 CASE 318F-05 ISSUE N
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SZNUD3112DMT1G Details

  • Manufacturer Part Number:

    SZNUD3112DMT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-74

  • Package Description:

    SC-74, 6 PIN

  • Manufacturer Package Code:

    318F-05

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.5 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    14 V

  • Supply Voltage-Nom:

    16 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.091 µs

  • Turn-on Time:

    0.021 µs

  • Width:

    1.5 mm

SZNUD3112DMT1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • The SZNUD3112DMT1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. A minimum of HBM (Human Body Model) Class 2 and MM (Machine Model) Class C ESD protection is recommended.
  • Yes, the SZNUD3112DMT1G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP (Production Part Approval Process) capable. However, additional testing and validation may be required for specific applications.
  • The recommended soldering conditions are: peak temperature of 260°C, time above 217°C of 30 seconds, and a total process time of 90 seconds. A nitrogen atmosphere is recommended to prevent oxidation.

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