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SZNZ8F18VSMX2WT5G - onsemi

Description: These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; Zener Breakdown Voltage Range 2.4 V to 47 V; Wettable Flank Package for optimal Automated Optical Inspection (AOI); ±5% and ±2% Tolerances Available

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SZNZ8F18VSMX2WT5G Details

  • Manufacturer Part Number:

    SZNZ8F18VSMX2WT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    X2DFNW2

  • Manufacturer Package Code:

    711BG

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2020-04-06

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    50 Ω

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PDSO-N2

  • JESD-609 Code:

    e4

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    18 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    14 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    2.28%

  • Working Test Current:

    5 mA

SZNZ8F18VSMX2WT5G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and implement thermal management techniques such as airflow or cooling systems.
  • The SZNZ8F18VSMX2WT5G has built-in ESD protection, but it's still important to follow standard ESD handling precautions, such as using an ESD wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
  • Yes, the SZNZ8F18VSMX2WT5G is suitable for high-reliability and automotive applications, as it meets the relevant industry standards and has been qualified for use in these environments.
  • The recommended soldering and assembly techniques for this device involve using a reflow soldering process, following the recommended soldering temperature profile, and using a suitable solder paste and flux.

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SZNZ8F18VSMX2WT5G Overview

Use the download button to access the SZNZ8F18VSMX2WT5G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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