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SZNZ9F6V8ST5G - onsemi

Description: Standard Zener Breakdown Voltage Range 2.4 V to 18 V; Steady State Power Rating of 250 mW; Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm); Low Body Height: 0.016 (0.40 mm); ESD Rating of Class 3 (>16 kV) per Human Body Model; Tight Tolerance VZ; These are PbFree Devices; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable

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SZNZ9F6V8ST5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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SZNZ9F6V8ST5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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SZNZ9F6V8ST5G Details

  • Manufacturer Part Number:

    SZNZ9F6V8ST5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923-2

  • Package Description:

    SOD-923, 2 PIN

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    40 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • Knee Impedance-Max:

    60 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    4.5 mV/°C

  • Voltage Tol-Max:

    2.06%

  • Working Test Current:

    5 mA

SZNZ9F6V8ST5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZNZ9F6V8ST5G should include a solid copper pour on the top and bottom layers, connected to the thermal pad through multiple vias. This helps to dissipate heat efficiently. Additionally, keep the component placement and routing symmetrical to minimize thermal gradients.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended operating conditions and derating guidelines provided in the datasheet. Also, consider using a heat sink or thermal interface material to improve heat dissipation. Regularly monitor the device's junction temperature and adjust the system design accordingly.
  • The SZNZ9F6V8ST5G has built-in ESD protection, but it's still important to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap, mat, or packaging materials, and avoid touching the device's pins or exposed die. Ground the device to a common point during handling and assembly.
  • Yes, the SZNZ9F6V8ST5G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended qualification and testing procedures, such as AEC-Q101, to ensure the device meets the required standards. Consult with onsemi's application engineers for specific guidance.
  • To troubleshoot issues with the SZNZ9F6V8ST5G, start by reviewing the datasheet and application notes. Check the device's operating conditions, PCB layout, and component selection. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the root cause of the issue. Consult with onsemi's technical support or a qualified engineer for further assistance.

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SZNZ9F6V8ST5G Overview

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