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SZP6SMB22CAT3G - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 22V 600W BI-DIR SZP6SMB AEC-Q101

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PCB Footprints
SZP6SMB22CAT3G - LITTELFUSE PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SZP6SMB22CAT3G
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3D Models
SZP6SMB22CAT3G - LITTELFUSE  - 3D model - Diodes Moulded Non Polarised - SZP6SMB22CAT3G
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SZP6SMB22CAT3G Details

  • Manufacturer Part Number:

    SZP6SMB22CAT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    23.1 V

  • Breakdown Voltage-Min:

    20.9 V

  • Breakdown Voltage-Nom:

    22 V

  • Clamping Voltage-Max:

    30.6 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    18.8 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    18.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZP6SMB22CAT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZP6SMB22CAT3G is a standard SMB footprint with a pad size of 0.5mm x 0.5mm and a spacing of 1.27mm between pads.
  • Yes, the SZP6SMB22CAT3G is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated for temperature to avoid thermal runaway.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal stress on the device.
  • Yes, the SZP6SMB22CAT3G is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the device's parasitic inductance and capacitance when designing the circuit.
  • The recommended storage condition for the SZP6SMB22CAT3G is in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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SZP6SMB22CAT3G Overview

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