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SZP6SMB30AT3G - LITTELFUSE

Description: Littelfuse SZP6SMB30AT3G, Uni-Directional TVS Diode, 600W, 2-Pin SMB

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PCB Footprints
SZP6SMB30AT3G - LITTELFUSE PCB footprint - Diodes Moulded - Diodes Moulded - SMB
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3D Models
SZP6SMB30AT3G - LITTELFUSE  - 3D model - Diodes Moulded - SMB
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SZP6SMB30AT3G Details

  • Manufacturer Part Number:

    SZP6SMB30AT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    31.5 V

  • Breakdown Voltage-Min:

    28.5 V

  • Breakdown Voltage-Nom:

    30 V

  • Clamping Voltage-Max:

    41.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    25.6 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    25.6 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SZP6SMB30AT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SZP6SMB30AT3G can be found in the Littelfuse application note AN9313, which provides guidelines for surface mount assembly of SMB packages.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider the maximum junction temperature (Tj) of 150°C. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal resistance.
  • Yes, the SZP6SMB30AT3G is AEC-Q101 qualified, which means it meets the stringent requirements for automotive applications. However, it is recommended to consult with Littelfuse or an authorized distributor to ensure that the device meets the specific requirements of the target application.
  • The SZP6SMB30AT3G can withstand a maximum surge current of 30A, as specified in the datasheet. However, it is recommended to consult with Littelfuse or an authorized distributor to determine the suitability of the device for specific surge current requirements.
  • To select the correct SZP6SMB30AT3G variant, consider the specific requirements of your application, including the voltage rating, current rating, and package type. Consult the datasheet and application notes provided by Littelfuse to ensure that the selected device meets the requirements of your application.

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SZP6SMB30AT3G Overview

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