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SZP6SMB47CAT3G - LITTELFUSE

Description: ESD Suppressors / TVS Diodes 47V 600W BI-DIR SZP6SMB AEC-Q101

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Symbol
SZP6SMB47CAT3G - LITTELFUSE - PCB symbol
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PCB Footprints
SZP6SMB47CAT3G - LITTELFUSE PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - 1SMB28CAT3G
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3D Models
SZP6SMB47CAT3G - LITTELFUSE - 3D model - Diodes Moulded Non Polarised - 1SMB28CAT3G
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SZP6SMB47CAT3G Details

  • Manufacturer Part Number:

    SZP6SMB47CAT3G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.98

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    49.4 V

  • Breakdown Voltage-Min:

    44.7 V

  • Breakdown Voltage-Nom:

    47.05 V

  • Clamping Voltage-Max:

    64.8 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    1.5 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    40.2 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    40.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZP6SMB47CAT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZP6SMB47CAT3G is a standard SMB footprint with a pad size of 1.5mm x 0.8mm and a spacing of 1.9mm between pads.
  • While the SZP6SMB47CAT3G has a maximum operating temperature of 150°C, it's recommended to derate the device's voltage and current ratings for prolonged exposure to high temperatures above 125°C to ensure reliability and prevent thermal runaway.
  • The SZP6SMB47CAT3G is designed to withstand surge currents up to 300A for 10/1000μs, but it's essential to consider the device's thermal response and ensure that the PCB design can handle the resulting heat generation.
  • Yes, the SZP6SMB47CAT3G is compatible with lead-free soldering processes, but it's crucial to follow the recommended soldering profile and temperature guidelines to prevent damage to the device.
  • While it's technically possible to use multiple SZP6SMB47CAT3G devices in parallel, it's not recommended due to potential mismatch and uneven current sharing between devices, which can lead to reduced reliability and increased failure rates.

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SZP6SMB47CAT3G Overview

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