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SZSM05T1G - onsemi

Description: SOT–23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Working Peak Reverse Voltage 5 V; Standard Zener Breakdown Voltage Range 6.2 V to 7.3 V; Peak Power – 300 Watt (8 X 20 µs); Low Leakage; Flammability Rating UL 94V–O; Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 ?C for 10 Seconds Package designed f

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PCB Footprints
SZSM05T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236]
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3D Models
SZSM05T1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236]
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SZSM05T1G Details

  • Manufacturer Part Number:

    SZSM05T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.46

  • Breakdown Voltage-Max:

    7.3 V

  • Breakdown Voltage-Min:

    6.2 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Clamping Voltage-Max:

    9.8 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZSM05T1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SZSM05T1G is a 1.6mm x 0.8mm pad with a 0.5mm radius corner, and a 0.3mm x 0.3mm thermal pad.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 150°C), and that the PCB is designed to minimize thermal resistance and ensure good heat dissipation.
  • The maximum allowable voltage stress on the SZSM05T1G is 1.5 times the rated voltage (5V) for a maximum duration of 100ms, and 1.2 times the rated voltage for a maximum duration of 1s.
  • To handle ESD protection for the SZSM05T1G, ensure that the device is handled and stored in an ESD-protected environment, and that the PCB is designed with ESD protection features such as TVS diodes or ESD-protection ICs.
  • The recommended storage condition for the SZSM05T1G is in a dry, cool place with a temperature range of -40°C to 30°C and humidity below 60%.

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SZSM05T1G Overview

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