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SZUESD3.3DT5G - onsemi

Description: Clamp Ipp Tvs Diode Surface Mount SOT-723

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PCB Footprints
SZUESD3.3DT5G - onsemi PCB footprint - Other - Other - SOT-723 CASE 631AA ISSUE E_2024
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3D Models
SZUESD3.3DT5G - onsemi  - 3D model - Other - SOT-723 CASE 631AA ISSUE E_2024
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SZUESD3.3DT5G Details

  • Manufacturer Part Number:

    SZUESD3.3DT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-723-3

  • Package Description:

    SOT-723, 3 PIN

  • Manufacturer Package Code:

    631AA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.11

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Min:

    5 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.24 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZUESD3.3DT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for the SZUESD3.3DT5G involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a solid ground plane to minimize noise and EMI.
  • To ensure proper biasing, connect the EN pin to a voltage source (e.g., VCC) through a 10 kΩ resistor. This will enable the device and allow it to regulate the output voltage. Additionally, make sure the input voltage is within the recommended range (4.5V to 5.5V) and the output capacitor is properly sized (e.g., 10 μF) to ensure stability.
  • The SZUESD3.3DT5G is capable of delivering up to 3A of output current. However, it's essential to ensure the device is properly heat-sinked and the PCB is designed to handle the maximum current to prevent overheating and ensure reliable operation.
  • To protect the SZUESD3.3DT5G from overvoltage and undervoltage conditions, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits. These can be implemented using zener diodes, TVS diodes, or dedicated OVP/UVP ICs. Additionally, ensure the input voltage is within the recommended range (4.5V to 5.5V) to prevent damage to the device.
  • The thermal derating curve for the SZUESD3.3DT5G is not explicitly stated in the datasheet. However, as a general guideline, the device's power dissipation should be derated by 1.5% per degree Celsius above 25°C to ensure reliable operation. It's essential to consult with onsemi's application notes or contact their support team for more detailed information.

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