T1035H-6G - STMicroelectronics

T1035H-6G Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  STMicroelectronics provides a recommended PCB layout in their application note AN5046, which includes guidelines for thermal pad connection, copper pouring, and via placement to ensure optimal thermal performance.
• How do I select the correct gate driver for this IGBT?
  When selecting a gate driver for the T1035H-6G, consider the driver's output current capability, voltage rating, and propagation delay. Ensure the driver can provide a sufficient voltage swing to fully turn on the IGBT. STMicroelectronics recommends using their L638x or L639x gate driver families.
• What is the maximum allowed dv/dt for this IGBT?
  The maximum allowed dv/dt for the T1035H-6G is not explicitly stated in the datasheet. However, as a general guideline, STMicroelectronics recommends limiting dv/dt to 5 kV/μs or less to prevent unwanted turn-on and ensure reliable operation.
• Can I use this IGBT in a parallel configuration?
  Yes, the T1035H-6G can be used in a parallel configuration, but it's essential to ensure that the devices are properly matched, and the gate drive signals are synchronized. STMicroelectronics provides guidelines for parallel operation in their application note AN4535.
• What is the recommended cooling system for high-power applications?
  For high-power applications, STMicroelectronics recommends using a forced-air cooling system or a liquid cooling system to maintain the IGBT's junction temperature within the recommended operating range. The specific cooling system design will depend on the application's power requirements and thermal constraints.