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T2800DG - onsemi

Description: TRIAC, 400V 8A, Gate Trigger 2.5V 60mA, 4-pin TO-220AB

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PCB Footprints
T2800DG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−220AB21
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3D Models
T2800DG - onsemi  - 3D model - Transistor Outline, Vertical - TO−220AB21
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T2800DG Details

  • Manufacturer Part Number:

    T2800DG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-220AB

  • Package Description:

    LEAD FREE, CASE 221A-07, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    221A-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    onsemi

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    4 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    75 V/us

  • DC Gate Trigger Current-Max:

    25 mA

  • DC Gate Trigger Voltage-Max:

    2.5 V

  • Holding Current-Max:

    30 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    8 A

  • Repetitive Peak Off-state Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    4 QUADRANT LOGIC LEVEL TRIAC

T2800DG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the T2800DG, the SOA is limited by the maximum voltage rating (Vds) and the maximum current rating (Id). Operating within these limits ensures safe and reliable operation.
  • Handle the device with an ESD wrist strap or mat, and ensure that the PCB has ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage from static electricity.
  • A gate drive circuit with a high-current, low-impedance driver and a suitable gate resistor is recommended. The gate drive voltage should be within the recommended range (typically 10-15V) to ensure proper switching.

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T2800DG Overview

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