T810H-6G footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

T810H-6G - STMicroelectronics PCB footprint - Other - Other - D2PAK_2025-7

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Part Number T810H-6G
Manufacturer STMicroelectronics
Pin Count 4
Part Category Triac A
Package Category Other
Footprint Name Other - D2PAK_2025-7
Released Date Aug 30, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

T810H-6G Details

Manufacturer Part Number:
T810H-6G
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
D2PAK
Package Description:
ROHS COMPLIANT, D2PAK-3
Pin Count:
3
Reach Compliance Code:
Compliant
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.30.00.80
Factory Lead Time:
15 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6
Additional Feature:
SENSITIVE GATE
Configuration:
SINGLE
Critical Rate of Rise of Off-State Voltage-Min:
75 V/us
DC Gate Trigger Current-Max:
10 mA
DC Gate Trigger Voltage-Max:
1 V
Holding Current-Max:
25 mA
JESD-30 Code:
R-PDSO-G3
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
RMS On-state Current-Max:
8 A
Repetitive Peak Off-state Voltage:
600 V
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Trigger Device Type:
TRIAC

T810H-6G Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots. Monitor junction temperature (TJ) and adjust the system design accordingly.
Monitor the device's junction temperature (TJ), drain-source voltage (VDS), and drain current (ID) to detect potential faults. Implement over-temperature protection (OTP), over-current protection (OCP), and under-voltage lockout (UVLO) to ensure safe operation.
Use a dedicated gate driver IC or a high-current, low-impedance gate drive circuit. Ensure a fast rise time (tr) and fall time (tf) to minimize switching losses. Optimize the gate resistance (RG) and gate-source voltage (VGS) for efficient switching.
Implement ESD protection diodes (e.g., TVS or Zener diodes) between the drain and source pins. Use ESD-sensitive handling and storage procedures. Ensure a safe and controlled environment during manufacturing and assembly.

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T810H-6G Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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