T835-600B footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

T835-600B - STMicroelectronics PCB footprint - Other - Other - D-PAK 3-Pin_2025-1

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Part Number T835-600B
Manufacturer STMicroelectronics
Pin Count 3
Part Category Triac A
Package Category Other
Footprint Name Other - D-PAK 3-Pin_2025-1
Released Date Jul 14, 2015
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

T835-600B Details

Manufacturer Part Number:
T835-600B
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-252
Package Description:
DPAK-3
Pin Count:
3
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.30.00.80
Factory Lead Time:
15 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6
Additional Feature:
SENSITIVE GATE
Case Connection:
MAIN TERMINAL 2
Configuration:
SINGLE
Critical Rate of Rise of Off-State Voltage-Min:
500 V/us
DC Gate Trigger Current-Max:
35 mA
DC Gate Trigger Voltage-Max:
1.3 V
Holding Current-Max:
35 mA
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Leakage Current-Max:
0.01 mA
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
RMS On-state Current-Max:
8 A
Repetitive Peak Off-state Voltage:
600 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Trigger Device Type:
SNUBBERLESS TRIAC

T835-600B Frequently Asked Questions (FAQs)

A good thermal design should include a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. The T835-600B should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the T835-600B. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
The recommended soldering conditions for the T835-600B are: peak temperature of 260°C, soldering time of 10-15 seconds, and a soldering iron temperature of 350°C. It's essential to follow these conditions to prevent damage to the device.
To protect the T835-600B from ESD, handle the device in an ESD-protected environment, use ESD-protected packaging, and ensure that all equipment and tools are properly grounded. It's also recommended to use an ESD wrist strap or mat when handling the device.
The recommended storage conditions for the T835-600B are: temperature range of -40°C to 125°C, relative humidity of 60% or less, and protection from direct sunlight and moisture.

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T835-600B Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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