T850-6G footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

T850-6G - STMicroelectronics PCB footprint - Other - Other - D²PAK_2025-28

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Part Number T850-6G
Manufacturer STMicroelectronics
Pin Count 3
Part Category Triac A
Package Category Other
Footprint Name Other - D²PAK_2025-28
Released Date Aug 30, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

T850-6G Details

Manufacturer Part Number:
T850-6G
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
15 Weeks
Date Of Intro:
2017-02-10
Manufacturer:
STMicroelectronics
YTEOL:
6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Peak Reflow Temperature (Cel):
245
Terminal Finish:
Matte Tin (Sn)
Trigger Device Type:
SNUBBERLESS TRIAC

T850-6G Frequently Asked Questions (FAQs)

STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure proper PCB design and layout to minimize thermal resistance.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling, placed as close to the T850-6G as possible.
Use a shielded enclosure, keep the T850-6G away from antennas and other EMI sources, and ensure proper PCB layout and grounding to minimize radiation.
The maximum allowed voltage drop is 0.5V. Exceeding this may affect the device's reliability and performance.

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T850-6G Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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