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TA6F15AHM3_A/H - Vishay

Description: ESD Suppressors / TVS Diodes High Temp DO-221AC AEC-Q101 Qualified

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PCB Footprints
TA6F15AHM3_A/H - Vishay PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SlimSMA (DO-221AC)
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TA6F15AHM3_A/H - Vishay  - 3D model - Small Outline Diode Flat Lead - SlimSMA (DO-221AC)
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TA6F15AHM3_A/H Details

  • Manufacturer Part Number:

    TA6F15AHM3_A/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    5 Weeks

  • Date Of Intro:

    2016-09-25

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.91

  • Additional Feature:

    HIGH RELIABILITY, EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    15.8 V

  • Breakdown Voltage-Min:

    14.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-221AC

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    185 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.1 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    12.8 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

TA6F15AHM3_A/H Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TA6F15AHM3_A/H is a rectangular pad with dimensions of 5.3 mm x 2.7 mm, with a thermal pad of 2.5 mm x 2.5 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area for the thermal pad.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air soldering station to solder the component. Avoid using excessive solder or flux, as it can cause shorts or damage to the component.
  • The maximum power dissipation of the TA6F15AHM3_A/H is 15 W, but it can be derated based on the ambient temperature and the thermal resistance of the PCB. It's essential to ensure that the component is properly heat-sinked and that the PCB is designed to dissipate heat efficiently.
  • The TA6F15AHM3_A/H is a commercial-grade component, and it may not meet the requirements for high-reliability or aerospace applications. Vishay Intertechnologies offers other components that are specifically designed and qualified for these applications, such as the MIL-PRF-19500 or ESCC-qualified components.
  • The TA6F15AHM3_A/H should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be handled with care to avoid mechanical stress, and it should be stored in its original packaging or a similar anti-static package to prevent electrostatic discharge (ESD) damage.

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TA6F15AHM3_A/H Overview

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