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TA6F30AHM3_A/H - Vishay

Description: ESD Suppressors / TVS Diodes High Temp DO-221AC AEC-Q101 Qualified

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TA6F30AHM3_A/H - Vishay - PCB symbol
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TA6F30AHM3_A/H - Vishay PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - TA6F30AHM3_A/H
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TA6F30AHM3_A/H Details

  • Manufacturer Part Number:

    TA6F30AHM3_A/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    5 Weeks

  • Date Of Intro:

    2016-09-25

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.91

  • Additional Feature:

    HIGH RELIABILITY, EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    31.5 V

  • Breakdown Voltage-Min:

    28.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-221AC

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    185 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.1 W

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    25.6 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

TA6F30AHM3_A/H Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TA6F30AHM3_A/H is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined gap of 0.2mm.
  • The thermal pad of the TA6F30AHM3_A/H should be connected to a copper plane on the PCB to ensure good thermal dissipation. A thermal via or a thermal pad with a diameter of at least 1.5mm is recommended.
  • The maximum operating temperature range for the TA6F30AHM3_A/H is -55°C to 150°C. However, the device is only guaranteed to meet its electrical specifications within the range of -40°C to 125°C.
  • Yes, the TA6F30AHM3_A/H is suitable for high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability. However, it is recommended to follow the recommended operating conditions and derating guidelines to ensure the device's reliability.
  • To ensure proper soldering of the TA6F30AHM3_A/H, follow the recommended soldering profile: peak temperature of 260°C, time above 217°C of 20-40 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point of 217°C or higher.

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TA6F30AHM3_A/H Overview

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