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TBD62083AFG(Z,EL) - Toshiba

Description: Transistor Array 8-Ch 500mA 50V SOP18

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TBD62083AFG(Z,EL) - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SOP18-P-375-1.27
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TBD62083AFG(Z,EL) - Toshiba  - 3D model - Small Outline Packages - SOP18-P-375-1.27
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TBD62083AFG(Z,EL) Details

  • Manufacturer Part Number:

    TBD62083AFG(Z,EL)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • Length:

    13 mm

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP18,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.8 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    7 mm

TBD62083AFG(Z,EL) Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the power traces short and away from the analog signals. Use a common mode choke and a ferrite bead to filter the power supply.
  • Monitor the junction temperature (TJ) and ensure it stays within the recommended range of -40°C to 125°C. Also, ensure the input voltage (VIN) is within the recommended range of 2.5V to 5.5V.
  • The maximum allowable power dissipation is 1.5W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended range to prevent overheating.
  • Yes, TBD62083AFG(Z,EL) is suitable for high-reliability applications. It has a high MTBF (Mean Time Between Failures) and is designed to meet the requirements of automotive and industrial applications.
  • Use an oscilloscope to monitor the input and output signals. Check for proper power supply decoupling, ensure the device is properly heat-sinked, and verify the PCB layout meets the recommended guidelines.

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TBD62083AFG(Z,EL) Overview

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