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TBD62083AFNG,EL - Toshiba

Description: BiCD Integrated Circuit Silicon Monolithic

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PCB Footprints
TBD62083AFNG,EL - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SOP18-P-375-1.27
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3D Models
TBD62083AFNG,EL - Toshiba  - 3D model - Small Outline Packages - SOP18-P-375-1.27
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TBD62083AFNG,EL Details

  • Manufacturer Part Number:

    TBD62083AFNG,EL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.3

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • Length:

    6.5 mm

  • Number of Functions:

    8

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP18,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BCD

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.8 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    4.4 mm

TBD62083AFNG,EL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for TBD62083AFNG,EL is to use a 4-layer board with a solid ground plane, and to keep the analog and digital signal traces separate to minimize noise and interference.
  • To ensure the TBD62083AFNG,EL is properly powered, use a high-quality power supply with low ripple and noise, and decouple the power pins with 0.1uF and 10uF capacitors to reduce noise and voltage drops.
  • The maximum operating temperature range for TBD62083AFNG,EL is -40°C to 125°C, but it's recommended to operate within -20°C to 85°C for optimal performance and reliability.
  • To troubleshoot issues with the TBD62083AFNG,EL, use a logic analyzer or oscilloscope to monitor the input and output signals, and check the power supply and PCB layout for any issues or noise.
  • Yes, the TBD62083AFNG,EL is suitable for high-reliability applications, but it's recommended to follow Toshiba's guidelines for reliability and to perform thorough testing and validation to ensure the device meets the required standards.

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TBD62083AFNG,EL Overview

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