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TBD62083AFWG - Toshiba

Description: Power Switch/Driver 1:1 N-Channel 500mA 18-SOP

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TBD62083AFWG - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - P-SOP18-0812-1.27-001
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TBD62083AFWG - Toshiba  - 3D model - Small Outline Packages - P-SOP18-0812-1.27-001
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TBD62083AFWG Details

  • Manufacturer Part Number:

    TBD62083AFWG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    8

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • Length:

    11.515 mm

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP18,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    2.85 mm

  • Supply Voltage-Max:

    25 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.8 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    7.495 mm

TBD62083AFWG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The TBD62083AFWG has an exposed thermal pad, so a thermal relief pattern on the PCB is necessary to ensure good thermal conductivity.
  • Ensure that the TBD62083AFWG is operated within its recommended temperature range (-40°C to 125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the PCB is designed to minimize thermal resistance.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the TBD62083AFWG as possible to minimize parasitic inductance.
  • Use a shielded enclosure, keep the TBD62083AFWG away from antennas and other EMI-sensitive components, and use a common-mode choke or ferrite bead on the input lines to reduce EMI emissions.
  • The maximum allowed voltage drop across the TBD62083AFWG is 0.5V. Exceeding this voltage drop may affect the device's reliability and performance.

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TBD62083AFWG Overview

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