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TBD62783AFNG,EL - Toshiba

Description: Gate Drivers DMOS Transistor Array 7-CH, 50V/0.5A

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TBD62783AFNG,EL - Toshiba - PCB symbol
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PCB Footprints
TBD62783AFNG,EL - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SSOP18-P-225-0.65
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3D Models
TBD62783AFNG,EL - Toshiba - 3D model - Small Outline Packages - SSOP18-P-225-0.65
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TBD62783AFNG,EL Details

  • Manufacturer Part Number:

    TBD62783AFNG,EL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-18

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.05

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G18

  • Length:

    6.5 mm

  • Number of Functions:

    8

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE

  • Output Current-Max:

    0.4 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    SSOP18,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.55 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Max:

    50 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    DMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

TBD62783AFNG,EL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for TBD62783AFNG is a 4-layer board with a solid ground plane, and the IC should be placed near the center of the board to minimize noise and EMI. A minimum of 2mm clearance around the IC is recommended.
  • Proper cooling can be achieved by providing a heat sink with a thermal resistance of 10°C/W or less, and ensuring good airflow around the IC. The heat sink should be attached using a thermal interface material with a thermal conductivity of 1W/m-K or higher.
  • The maximum allowed voltage on the input pins of TBD62783AFNG is 6V, exceeding which may cause damage to the IC. It is recommended to use voltage limiting resistors or clamping diodes to prevent overvoltage.
  • While TBD62783AFNG is rated for operation up to 125°C, it is recommended to derate the IC's power dissipation by 50% when operating above 85°C to ensure reliability. Additionally, the IC's junction temperature should be monitored to prevent overheating.
  • To troubleshoot TBD62783AFNG, first verify that the power supply voltage is within the recommended range, and check for any signs of overheating or physical damage. Use an oscilloscope to verify the input and output waveforms, and consult the datasheet for specific troubleshooting guidelines.

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TBD62783AFNG,EL Overview

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TBD62783AFNG,EL Alternates

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Part Image TBD62783AFNG Toshiba America Electronic Components

Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.4A, DMOS, PDSO18