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TBS806 - Taiwan Semiconductor

Description: Bridge Rectifier Single Phase Standard 600 V Surface Mount TBS,Voltage - Forward (Vf) (Max) @ If 1.05 V @ 8 A,Operating Temperature -55°C ~ 150°C (TJ)

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TBS806 - Taiwan Semiconductor PCB footprint - Other - Other - TBS_2025
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TBS806 Details

  • Manufacturer Part Number:

    TBS806

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-10-12

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    7.35

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.05 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

TBS806 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance involves placing thermal vias under the TBS806 package, using a solid ground plane, and keeping the thermal path as short as possible. Additionally, using a thermal pad on the bottom of the package can help to dissipate heat more efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and use a thermal management system. Additionally, consider using a thermistor or thermal sensor to monitor the temperature and implement thermal shutdown or throttling if necessary.
  • The TBS806 has a maximum power dissipation of 2.5W, and it's essential to ensure that the device does not exceed this rating. Additionally, the device has a limited current handling capability, and exceeding this can lead to device damage or failure. It's crucial to follow the recommended operating conditions and ensure that the device is properly heat-sinked.
  • To troubleshoot issues with the TBS806, start by verifying that the device is properly powered and that the input voltage is within the recommended range. Check for any signs of overheating, and ensure that the device is properly heat-sinked. Use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the TBS806 is a sensitive device and requires proper ESD protection measures to prevent damage. Handle the device in an ESD-controlled environment, use ESD-safe packaging and handling materials, and ensure that all personnel handling the device are properly grounded. Follow the recommended ESD protection procedures outlined in the datasheet and industry standards.

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TBS806 Overview

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