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TC1185-2.5VCT713 - Microchip

Description: LDO Regulator 150mA 2.5V SHDN SOT23-5

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TC1185-2.5VCT713 - Microchip - PCB symbol
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PCB Footprints
TC1185-2.5VCT713 - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TC1185-2.5VCT713-1
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3D Models
TC1185-2.5VCT713 - Microchip - 3D model - SOT23 (5-Pin) - TC1185-2.5VCT713-1
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TC1185-2.5VCT713 Details

  • Manufacturer Part Number:

    TC1185-2.5VCT713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.4 V

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    2.7 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.00875%

  • Load Regulation-Max:

    0.075%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Output Voltage1-Max:

    2.5625 V

  • Output Voltage1-Min:

    2.4375 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.55 mm

TC1185-2.5VCT713 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the PCB layout allows for good airflow around the device.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered. Additionally, consider using a thermally conductive material for the PCB substrate.
  • To mitigate EMI and RFI, use a multi-layer PCB with a solid ground plane, and ensure that the device is placed away from noise sources. Use shielding or metal enclosures to contain EMI, and consider using EMI filters or common-mode chokes to reduce emissions.
  • To troubleshoot issues with the device not regulating the output voltage, check the input voltage, output voltage, and feedback resistors. Ensure that the feedback resistors are correctly connected and that the output voltage is within the specified range. Also, verify that the device is properly soldered and that there are no shorts or opens on the PCB.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It is essential to operate the device within the specified operating conditions to ensure reliable and optimal performance.

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TC1185-2.5VCT713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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