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TC1262-3.3VEBTR - Microchip

Description: Microchip TC1262-3.3VEBTR, LDO Voltage Regulator, 500mA, 3.3 V ±0.5%, 2.7 → 6 Vin, 3-Pin D2PAK

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PCB Footprints
TC1262-3.3VEBTR - Microchip PCB footprint - Other - Other - EB DDPAK
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TC1262-3.3VEBTR Details

  • Manufacturer Part Number:

    TC1262-3.3VEBTR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    D2PAK-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    DDPAK-3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.65 V

  • Dropout Voltage1-Nom:

    0.35 V

  • Input Voltage Absolute-Max:

    6.5 V

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    R-PSSO-G3

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Line Regulation-Max:

    0.01155%

  • Load Regulation-Max:

    0.164967%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.3825 V

  • Output Voltage1-Min:

    3.2175 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP3H,.55TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    5.08 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    2.5%

  • Width:

    9.017 mm

TC1262-3.3VEBTR Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow a star-grounding layout, keeping the input and output capacitors close to the device, and using a solid ground plane to minimize noise and EMI. Additionally, ensure that the device is placed away from high-current carrying traces and heat sources.
  • To ensure stability, ensure that the output capacitor is within the recommended range (10uF to 22uF), and the input capacitor is at least 1uF. Also, make sure the device is operated within the recommended input voltage range (2.7V to 5.5V) and the output is not overloaded.
  • The TC1262-3.3VEBTR is capable of delivering up to 150mA of output current. However, it is recommended to derate the output current to 100mA for optimal performance and to prevent overheating.
  • To protect the device from input voltage transients and surges, it is recommended to add a TVS (Transient Voltage Suppressor) diode or a voltage clamp circuit at the input. Additionally, ensure that the input capacitor is rated for the maximum expected input voltage.
  • The thermal derating curve for the TC1262-3.3VEBTR can be found in the datasheet. As a general guideline, the device can operate up to 125°C, but the output current capability will decrease as the temperature increases. It is recommended to keep the device temperature below 85°C for optimal performance.

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TC1262-3.3VEBTR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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