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TC1411NEUA713 - Microchip

Description: Gate Drivers 1A Sngl N-Inv

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TC1411NEUA713 - Microchip - PCB symbol
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PCB Footprints
TC1411NEUA713 - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - msop_2020
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3D Models
TC1411NEUA713 - Microchip - 3D model - Small Outline Packages - msop_2020
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TC1411NEUA713 Details

  • Manufacturer Part Number:

    TC1411NEUA713

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Peak Current Limit-Nom:

    1 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    16 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage1-Max:

    16 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    0.085 µs

  • Turn-on Time:

    0.085 µs

  • Width:

    3 mm

TC1411NEUA713 Frequently Asked Questions (FAQs)

  • Microchip recommends following a 4-layer PCB stack-up with a solid ground plane, and using a star-connection for the power pins. Additionally, keep the input and output traces short and away from each other, and use a common-mode choke or ferrite bead to filter the output.
  • Use a minimum of 2x 10uF ceramic capacitors (X5R or X7R dielectric) in parallel, placed as close as possible to the VIN and VOUT pins. Add a 1uF ceramic capacitor in parallel with the 10uF capacitors for additional filtering.
  • The absolute maximum input voltage rating is 18V, but it's recommended to operate the device within the specified input voltage range of 4.5V to 15V to ensure reliable operation and minimize stress on the device.
  • The TC1411NEUA713 is rated for operation up to 125°C, but the device's performance and reliability may degrade at higher temperatures. Ensure proper thermal management and consider derating the output current and voltage according to the datasheet's thermal derating curves.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly bypassed and that the input and output capacitors are of sufficient value and type. Use an oscilloscope to monitor the output voltage and input voltage ripple. Consult the datasheet and application notes for troubleshooting guidelines.

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TC1411NEUA713 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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