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TC212S8F133SCACKXUMA1 - Infineon

Description: TriCore™ AURIX™ Microcontroller IC 32-Bit 133MHz 512KB (512K x 8) FLASH PG-TQFP-80-7

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Symbol
TC212S8F133SCACKXUMA1 - Infineon - PCB symbol
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PCB Footprints
TC212S8F133SCACKXUMA1 - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - PG-TQFP-80-7_2025
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3D Models
TC212S8F133SCACKXUMA1 - Infineon - 3D model - Quad Flat Packages - PG-TQFP-80-7_2025
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TC212S8F133SCACKXUMA1 Details

  • Manufacturer Part Number:

    TC212S8F133SCACKXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-80

  • Country Of Origin:

    Germany, Taiwan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    TC21X

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G80

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of I/O Lines:

    59

  • Number of Serial I/Os:

    5

  • Number of Terminals:

    80

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP80,.47SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • RAM (bytes):

    57344

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Screening Level:

    ISO 26262

  • Seated Height-Max:

    1.2 mm

  • Speed:

    133 MHz

  • Supply Current-Max:

    99 mA

  • Supply Voltage-Max:

    1.43 V

  • Supply Voltage-Min:

    1.17 V

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

TC212S8F133SCACKXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide and thermal design guidelines in their application notes and layout recommendations. It's essential to follow these guidelines to ensure optimal thermal performance and reliability.
  • Infineon provides EMC and EMI guidelines in their application notes and datasheets. Additionally, following industry standards such as IEC 61967 and IEC 62132 can help ensure compliance. It's also recommended to perform EMC and EMI testing during the design validation process.
  • Infineon provides soldering and assembly guidelines in their application notes and datasheets. It's essential to follow these guidelines to ensure reliable connections and to prevent damage during the assembly process.
  • Infineon provides troubleshooting guides and FAQs in their application notes and datasheets. Additionally, using oscilloscopes, logic analyzers, and other debugging tools can help identify and resolve issues. It's also recommended to consult with Infineon's technical support team or online forums for additional guidance.
  • The TC212S8F133SCACKXUMA1 is rated for operation in specific temperature, humidity, and vibration ranges. It's essential to ensure that the device operates within these specified conditions to maintain performance and reliability. Additionally, environmental factors such as air quality, moisture, and contamination can affect the device's performance and should be considered during the design process.

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TC212S8F133SCACKXUMA1 Overview

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