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TC233LP32F200NACKXUMA1 - Infineon

Description: INFINEON - TC233LP32F200NACKXUMA1 - MCU, 32BIT, 200MHZ, TQFP-100

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TC233LP32F200NACKXUMA1 - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - PG-TQFP-100-23
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TC233LP32F200NACKXUMA1 - Infineon  - 3D model - Quad Flat Packages - PG-TQFP-100-23
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TC233LP32F200NACKXUMA1 Details

  • Manufacturer Part Number:

    TC233LP32F200NACKXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTFQFP,

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Date Of Intro:

    2017-11-24

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8.13

  • Has ADC:

    YES

  • Additional Feature:

    IT HAS 24 ADC AND FADC I/P LINES ,2 ADC MODULE

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    200 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    100

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • RAM (bytes):

    196608

  • ROM (words):

    2097152

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    200 MHz

  • Supply Voltage-Max:

    1.43 V

  • Supply Voltage-Min:

    1.17 V

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

TC233LP32F200NACKXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for PCB layout and thermal management in the datasheet and application notes. It's essential to follow these guidelines to ensure optimal performance and thermal dissipation.
  • To minimize power consumption, use the microcontroller's low-power modes (e.g., sleep, standby) and optimize the clock frequency, voltage, and peripheral usage. Refer to the datasheet and application notes for specific guidance.
  • Implement secure boot mechanisms, use encryption and secure communication protocols, and follow Infineon's guidelines for secure firmware development. Additionally, consider using the microcontroller's built-in security features, such as the Hardware Security Module (HSM).
  • Use Infineon's development tools, such as the DAVE 4 development environment, and debugging tools like the Universal Debug Engine (UDE). Also, consult the datasheet, application notes, and online forums for troubleshooting guidance.
  • Verify the compatibility of the microcontroller with other components and modules by checking the datasheets and application notes. Ensure that the interfaces, voltage levels, and communication protocols are compatible.

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TC233LP32F200NACKXUMA1 Overview

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