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TC358746AXBG - Toshiba

Description: Display Driver Driver 3.6V 72-Pin VFBGA

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PCB Footprints
TC358746AXBG - Toshiba PCB footprint - BGA - BGA - 12065Z106KAT2A
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3D Models
TC358746AXBG - Toshiba  - 3D model - BGA - 12065Z106KAT2A
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TC358746AXBG Details

  • Manufacturer Part Number:

    TC358746AXBG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PBGA-B72

  • Length:

    4.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    72

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA72,9x9,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.3 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.5 mm

TC358746AXBG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital signal traces separate and avoid crossing them over each other.
  • Use a low-ESR capacitor (e.g., 0.1uF) between VCC and GND, and a 10uF capacitor between AVCC and AGND. Place these capacitors as close to the device as possible.
  • The maximum clock frequency supported is 150 MHz. However, the actual frequency may vary depending on the system design and signal integrity.
  • Configure the device for HDMI 2.0 mode by setting the appropriate registers (e.g., HDMI_VER to 0x02) and ensuring the correct clock frequency and signal routing.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device and avoid blocking airflow with nearby components.

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