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TC358748XBG(EL) - Toshiba

Description: IC MIPI CSI2 TO PARALLEL 80VFBGA

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Symbol
TC358748XBG(EL) - Toshiba - PCB symbol
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PCB Footprints
TC358748XBG(EL) - Toshiba PCB footprint - BGA - BGA - P-VFBGA80-0707-0.65-001
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3D Models
TC358748XBG(EL) - Toshiba - 3D model - BGA - P-VFBGA80-0707-0.65-001
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TC358748XBG(EL) Details

  • Manufacturer Part Number:

    TC358748XBG(EL)

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-100/80

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PBGA-B80

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA80,10X10,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.3 V

  • Supply Voltage-Min:

    1.1 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

TC358748XBG(EL) Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital signal traces separate and avoid crossing them over each other.
  • Use a low-ESR capacitor (e.g., 0.1uF) for power supply decoupling, and place it as close to the VCC pin as possible. Also, ensure a stable power supply voltage and a low-impedance power supply path.
  • The maximum clock frequency supported is 150 MHz, but it's recommended to operate at a frequency below 100 MHz for optimal performance and to minimize power consumption.
  • To configure the TC358748XBG(EL) for HDMI 2.0 compliance, set the device to HDMI 2.0 mode by writing to the appropriate registers. Refer to the datasheet and application notes for specific register settings and configuration details.
  • Use a heat sink with a thermal conductivity of at least 1 W/m-K, and ensure good airflow around the device. Keep the ambient temperature below 85°C and avoid exposing the device to direct sunlight or high humidity.

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TC358748XBG(EL) Overview

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