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TC377TP96F300SAAKXUMA1 - Infineon

Description: MCU 32-bit TriCore RISC 6MB Flash 3.3V/5V Automotive 292-Pin LFBGA T/R

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TC377TP96F300SAAKXUMA1 - Infineon PCB footprint - BGA - BGA - LFBGA-292
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TC377TP96F300SAAKXUMA1 - Infineon  - 3D model - BGA - LFBGA-292
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TC377TP96F300SAAKXUMA1 Details

  • Manufacturer Part Number:

    TC377TP96F300SAAKXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA-292

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Date Of Intro:

    2020-06-25

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8.2

  • Has ADC:

    YES

  • Additional Feature:

    ALSO SUPPORTS FLOATING POINT

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    TC37

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B292

  • JESD-609 Code:

    e2

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    128

  • Number of Serial I/Os:

    26

  • Number of Terminals:

    292

  • Number of Timers:

    5

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA292,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    1163264

  • ROM (words):

    6291456

  • ROM Programmability:

    FLASH

  • Screening Level:

    ISO 26262

  • Seated Height-Max:

    1.7 mm

  • Speed:

    300 MHz

  • Supply Voltage-Max:

    1.375 V

  • Supply Voltage-Min:

    1.125 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

TC377TP96F300SAAKXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for PCB layout and thermal management. It's essential to follow the recommended layout and thermal design guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • To minimize power consumption, use the low-power modes (e.g., sleep, standby) whenever possible. Optimize your code to reduce CPU usage, and consider using the built-in power gating features. Additionally, ensure that your PCB design minimizes power losses by using low-ESR capacitors and optimizing the power distribution network.
  • Implement a secure boot mechanism, use secure communication protocols (e.g., HTTPS, TLS), and encrypt sensitive data. Regularly update your firmware and software to ensure you have the latest security patches. Additionally, consider using Infineon's security-focused tools and libraries, such as the 'Infineon Security Partner' program.
  • Use Infineon's development tools, such as the 'DAVE' (Digital Application Virtual Engineer) development environment, which provides debugging and testing capabilities. You can also use third-party debugging tools, like oscilloscopes and logic analyzers, to identify and resolve issues.
  • Follow Infineon's EMC design guidelines, which include using shielding, filtering, and grounding techniques to minimize EMI. Ensure your PCB design meets the necessary clearance and creepage distances, and consider using EMI-absorbing materials. Additionally, perform EMC testing and certification to ensure compliance with relevant standards.

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TC377TP96F300SAAKXUMA1 Overview

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