TC397XP256F300SBCKXUMA1 - Infineon

TC397XP256F300SBCKXUMA1 Details

• Manufacturer Part Number:

  TC397XP256F300SBCKXUMA1

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  BGA-292

• ECCN Code:

  3A991.a.2

• HTS Code:

  8542.31.00.25

• Factory Lead Time:

  53 Weeks, 1 Day

• Date Of Intro:

  2020-01-02

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  0

• Has ADC:

  YES

• Bit Size:

  32

• Clock Frequency-Max:

  160 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• JESD-30 Code:

  S-PBGA-B292

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  292

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• ROM Programmability:

  FLASH

• Screening Level:

  ISO 26262

• Seated Height-Max:

  1.7 mm

• Speed:

  300 MHz

• Supply Voltage-Max:

  3.63 V

• Supply Voltage-Min:

  2.97 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER