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TC4405CPA - Microchip

Description: Low-Side Gate Driver IC Non-Inverting 8-PDIP

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TC4405CPA - Microchip - PCB symbol
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PCB Footprints
TC4405CPA - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-PDIP_2020
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3D Models
TC4405CPA - Microchip - 3D model - Dual-In-Line Packages - 8-PDIP_2020
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TC4405CPA Details

  • Manufacturer Part Number:

    TC4405CPA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.271 mm

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    1.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.1 µs

  • Turn-on Time:

    0.08 µs

  • Width:

    7.62 mm

TC4405CPA Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's essential to decouple the power supply with a 10uF capacitor and to use a ferrite bead or a 10Ω resistor in series with the input to filter out high-frequency noise.
  • To ensure the TC4405CPA operates within its SOA, monitor the input voltage, output current, and junction temperature. The device should not exceed the maximum ratings specified in the datasheet. Additionally, use thermal management techniques such as heat sinks or thermal interfaces to keep the junction temperature below 150°C.
  • Microchip recommends using a low-ESR ceramic capacitor with a value between 1uF to 10uF, depending on the input voltage and output current requirements. A 4.7uF or 10uF X5R or X7R ceramic capacitor is a good starting point.
  • To troubleshoot issues with the TC4405CPA, use an oscilloscope to monitor the input and output waveforms, and check for signs of oscillation or instability. Verify the input voltage, output current, and component values meet the datasheet specifications. Also, ensure the PCB layout and routing follow the recommended guidelines.
  • The TC4405CPA is rated for operation up to 125°C, but its performance and reliability may degrade at higher temperatures. For high-temperature applications, consider using a thermally enhanced package or a heat sink to keep the junction temperature below 150°C. Consult the datasheet and Microchip's application notes for more information.

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TC4405CPA Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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