TC58NVG1S3EBAI5 - Toshiba

TC58NVG1S3EBAI5 Details

• Manufacturer Part Number:

  TC58NVG1S3EBAI5

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  TFBGA-63

• Pin Count:

  63

• Direct Group:

  ME1009482EI1

• Similar Group:

  ME101042105310021040YYYY

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Toshiba America Electronic Components

• YTEOL:

  0

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-PBGA-B63

• Length:

  13 mm

• Memory Density:

  2147483648 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  63

• Number of Words:

  268435456 words

• Number of Words Code:

  256000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  256MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA63,10X12,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Parallel/Serial:

  SERIAL

• Programming Voltage:

  3.3 V

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1 mm

• Standby Current-Max:

  0.00005 A

• Supply Current-Max:

  0.03 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Type:

  NAND TYPE

• Width:

  10 mm

• Write Cycle Time-Max (tWC):

  0.000025 ms

• Write Protection:

  HARDWARE