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TC58NVG1S3HBAI6 - Toshiba

Description: NAND Flash 3.3V 2Gb 24nm SLC NAND (EEPROM)

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PCB Footprints
TC58NVG1S3HBAI6 - Toshiba PCB footprint - BGA - BGA - P-VFBGA67
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3D Models
TC58NVG1S3HBAI6 - Toshiba  - 3D model - BGA - P-VFBGA67
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TC58NVG1S3HBAI6 Details

  • Manufacturer Part Number:

    TC58NVG1S3HBAI6

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    BGA

  • Package Description:

    BGA-67

  • Pin Count:

    67

  • Direct Group:

    ME1009482LGN

  • Similar Group:

    ME101042105310021198YYYY

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Toshiba America Electronic Components

  • JESD-30 Code:

    R-PBGA-B67

  • Length:

    8 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    67

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA67,8X10,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Type:

    SLC NAND TYPE

  • Width:

    6.5 mm

  • Write Protection:

    HARDWARE

TC58NVG1S3HBAI6 Frequently Asked Questions (FAQs)

  • Toshiba provides a recommended PCB layout guide in their application note (TAEC-AN-1201) which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and reliability.
  • The TC58NVG1S3HBAI6 has an internal POR and BOR circuitry. To handle these, ensure a stable power supply, add external capacitors to filter out noise, and consider using an external reset controller if additional functionality is required.
  • The TC58NVG1S3HBAI6 is rated for operation from -40°C to 85°C (industrial temperature range). However, it's essential to consider the specific application's temperature requirements and potential thermal management needs.
  • Toshiba provides a Secure Boot and Secure Firmware Update solution through their proprietary Secure Boot Loader (SBL) and Secure Firmware Update (SFU) tools. Consult the Toshiba documentation and application notes for implementation details.
  • The TC58NVG1S3HBAI6 requires a stable clock input (XCLK) with a frequency range of 12 MHz to 24 MHz. Ensure the clock signal meets the specified jitter and duty cycle requirements for reliable operation.

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