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TC74HC00APF - Toshiba

Description: Logic Gates 74HC CMOS logic IC DIP14

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PCB Footprints
TC74HC00APF - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP14-P-300-2.54
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TC74HC00APF - Toshiba  - 3D model - Dual-In-Line Packages - DIP14-P-300-2.54
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TC74HC00APF Details

  • Manufacturer Part Number:

    TC74HC00APF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-14

  • Pin Count:

    14

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    4.8

  • Family:

    HC/UH

  • JESD-30 Code:

    R-PDIP-T14

  • Length:

    19.25 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    NAND GATE

  • Max I(ol):

    0.0052 A

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    19 ns

  • Propagation Delay (tpd):

    95 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    4.45 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

TC74HC00APF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the TC74HC00APF is typically 100 MHz, but it can vary depending on the specific application and operating conditions.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and ensuring good airflow around the device.
  • It is recommended to use a 0.1 μF ceramic capacitor in parallel with a 10 μF electrolytic capacitor for power supply decoupling to ensure stable operation.
  • Yes, the TC74HC00APF can be used in a 5V system, but it is recommended to follow the recommended operating conditions and ensure that the input voltage does not exceed the maximum rating of 7V.
  • It is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensuring that the device is stored in an ESD-protected environment.

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TC74HC00APF Overview

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Part Image MM74HC00N Fairchild Semiconductor Corporation

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Part Image GD74HC00 MagnaChip Semiconductor Ltd

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Part Image CD54HC00F/3 Intersil Corporation

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For a full list of alternate parts for TC74HC00APF, check out Findchips.com