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TC74HC08AF - Toshiba

Description: Quad 2-Input/AND, SOP14

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TC74HC08AF - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - SOP14-P-300-1.27A
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TC74HC08AF - Toshiba  - 3D model - Small Outline Packages - SOP14-P-300-1.27A
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TC74HC08AF Details

  • Manufacturer Part Number:

    TC74HC08AF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.300 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOP-14

  • Pin Count:

    14

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Family:

    HC/UH

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    10.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.004 A

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    19 ns

  • Propagation Delay (tpd):

    95 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.9 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    5.3 mm

TC74HC08AF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the TC74HC08AF is typically around 100 MHz, but it can vary depending on the specific application and operating conditions.
  • The TC74HC08AF is a low-power device, but it's still important to ensure good thermal management. This can be achieved by providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources.
  • Yes, the TC74HC08AF is compatible with 5V systems. However, it's essential to ensure that the input voltage does not exceed the recommended maximum rating of 7V to prevent damage to the device.
  • To troubleshoot issues with the TC74HC08AF, start by verifying the power supply voltage, checking for proper connections, and ensuring that the input signals are within the recommended logic levels. You can also use a logic analyzer or oscilloscope to debug the circuit.
  • No, the TC74HC08AF is not a radiation-hardened device. It's designed for commercial applications and may not be suitable for use in high-radiation environments such as space or nuclear applications.

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TC74HC08AF Overview

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Part Image HD74HC08FP-E Renesas Electronics Corporation

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