TC74HCT7007AP - Toshiba

TC74HCT7007AP Details

• Manufacturer Part Number:

  TC74HCT7007AP

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  DIP

• Package Description:

  0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-14

• Pin Count:

  14

• HTS Code:

  8542.39.00.60

• Manufacturer:

  Toshiba America Electronic Components

• YTEOL:

  0

• Family:

  HCT

• JESD-30 Code:

  R-PDIP-T14

• Length:

  19.25 mm

• Load Capacitance (CL):

  50 pF

• Logic IC Type:

  BUFFER

• Max I(ol):

  0.004 A

• Number of Functions:

  6

• Number of Inputs:

  1

• Number of Terminals:

  14

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP14,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Power Supply Current-Max (ICC):

  50 mA

• Prop. Delay@Nom-Sup:

  28 ns

• Propagation Delay (tpd):

  28 ns

• Qualification Status:

  Not Qualified

• Schmitt Trigger:

  NO

• Seated Height-Max:

  4.45 mm

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  4.5 V

• Supply Voltage-Nom (Vsup):

  5 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  7.62 mm