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TC74HCU04AP - Toshiba

Description: The TC74HCU04AP is a high speed CMOS INVERTER fabricated with silicon gate C2MOS technology Hex Unbuffer, DIP14

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PCB Footprints
TC74HCU04AP - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP14-P-300-2.54
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3D Models
TC74HCU04AP - Toshiba  - 3D model - Dual-In-Line Packages - DIP14-P-300-2.54
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TC74HCU04AP Details

  • Manufacturer Part Number:

    TC74HCU04AP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    DIP-14

  • Pin Count:

    14

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Family:

    HC

  • JESD-30 Code:

    R-PDIP-T14

  • Length:

    19.25 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    INVERTER

  • Max I(ol):

    0.0052 A

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    15 ns

  • Propagation Delay (tpd):

    75 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    4.45 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.62 mm

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TC74HCU04AP Overview

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