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TC7QPB9307FT(EL) - Toshiba

Description: Digital Bus Switch ICs General-purpose Bus Switch Low Voltage/Low Power 4-Bit Dual Supply Bus Switch, Vcc:-V

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TC7QPB9307FT(EL) - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP14
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TC7QPB9307FT(EL) - Toshiba  - 3D model - Small Outline Packages - TSSOP14
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TC7QPB9307FT(EL) Details

  • Manufacturer Part Number:

    TC7QPB9307FT(EL)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-14

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.45

  • Additional Feature:

    ALSO OPERATES WITH 2.3-5.5 V SUPPLY

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    9306

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    5 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    BUS DRIVER

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supply Current-Max (ICC):

    25 mA

  • Prop. Delay@Nom-Sup:

    0.65 ns

  • Propagation Delay (tpd):

    0.65 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4.4 mm

TC7QPB9307FT(EL) Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout that minimizes signal trace length and uses a solid ground plane to reduce noise and electromagnetic interference. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure reliability in high-temperature applications, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its recommended operating temperature range.
  • To prevent electrostatic discharge (ESD) damage, handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper handling and storage procedures. It is also recommended to use an ESD wrist strap or mat when handling the device.
  • The TC7QPB9307FT(EL) is not specifically designed or tested for radiation-hardened applications. If radiation hardness is required, it is recommended to consult with Toshiba or a qualified radiation-hardened component supplier.
  • Toshiba recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. It is essential to follow the recommended soldering profile to prevent damage to the device.

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