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TCSOM0J226M8R - ROHM Semiconductor

Description: ROHM Tantalum Capacitor 22μF 6.3V dc Polymer ±20% Tolerance TCSO Series

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TCSOM0J226M8R - ROHM Semiconductor - PCB symbol
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TCSOM0J226M8R - ROHM Semiconductor PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - tcsom
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TCSOM0J226M8R - ROHM Semiconductor - 3D model - Capacitor Moulded Polarised - tcsom
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TCSOM0J226M8R Details

  • Manufacturer Part Number:

    TCSOM0J226M8R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    ESR IS MEASURED AT 100 KHZ, RIPPLE CURRENT IS MEASURED AT 100KHZ, 45CEL

  • Capacitance:

    22 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (SOLID POLYMER)

  • ESR:

    300 mΩ

  • Height:

    0.8 mm

  • JESD-609 Code:

    e2

  • Leakage Current:

    0.0139 mA

  • Length:

    1.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Style:

    SMT

  • Packing Method:

    TR, 7 Inch

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    6.3 V

  • Ripple Current:

    341 mA

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Tan Delta:

    0.15

  • Terminal Finish:

    TIN COPPER

  • Terminal Shape:

    WRAPAROUND

  • Width:

    0.85 mm

TCSOM0J226M8R Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout in their application note AN0914, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The TCSOM0J226M8R has a high power density, so thermal management is crucial. ROHM recommends using a thermal pad or heat sink, and ensuring good airflow around the component. The application note AN0914 provides more detailed guidelines.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, and a dwell time of 10-30 seconds. The application note AN0914 provides more detailed guidelines for reflow soldering and wave soldering.
  • ROHM recommends using a moisture-resistant coating or conformal coating to protect the component from moisture. Additionally, ensuring good PCB design and layout practices, such as using a ground plane and avoiding vias under the component, can help prevent moisture-related issues.
  • The ESR of the TCSOM0J226M8R is not explicitly stated in the datasheet, but it can be estimated based on the component's impedance and capacitance values. ROHM provides an ESR calculator tool on their website to help estimate the ESR.

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TCSOM0J226M8R Overview

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