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TCTOP1A106M8R - ROHM Semiconductor

Description: Tantalum Capacitors - Polymer SMD 0805 10uF 10V 20%

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TCTOP1A106M8R - ROHM Semiconductor PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - TCTOP1A106M8R
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TCTOP1A106M8R - ROHM Semiconductor  - 3D model - Capacitor Moulded Polarised - TCTOP1A106M8R
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TCTOP1A106M8R Details

  • Manufacturer Part Number:

    TCTOP1A106M8R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Additional Feature:

    ESR IS MEASURED AT 100KHZ, RIPPLE CURRENT IS MEASURED AT 100KHZ AND 45CEL

  • Capacitance:

    10 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (SOLID POLYMER)

  • ESR:

    300 mΩ

  • Height:

    1.2 mm

  • JESD-609 Code:

    e2

  • Leakage Current:

    0.01 mA

  • Length:

    2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, 7 Inch

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    10 V

  • Ripple Current:

    387 mA

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Tan Delta:

    0.15

  • Terminal Finish:

    TIN COPPER

  • Terminal Shape:

    WRAPAROUND

  • Width:

    1.25 mm

TCTOP1A106M8R Frequently Asked Questions (FAQs)

  • The recommended land pattern for TCTOP1A106M8R can be found in the ROHM Semiconductor's packaging specification document, which is usually available on their website. The document provides detailed information on the recommended pad layout, solder mask, and soldering conditions.
  • To handle thermal considerations for TCTOP1A106M8R, ensure that the device is mounted on a PCB with a sufficient thermal conductivity. A thermal via or a thermal pad can be used to improve heat dissipation. Additionally, consider using a heat sink or a thermal interface material to reduce the thermal resistance.
  • The moisture sensitivity level of TCTOP1A106M8R is MSL 3, which means that the device can be exposed to a maximum of 168 hours of moisture before soldering. It's essential to follow the recommended storage and handling procedures to prevent moisture-related damage.
  • While TCTOP1A106M8R is a robust component, it's essential to evaluate its suitability for high-vibration environments. ROHM Semiconductor provides vibration testing data in their reliability test report, which can be used to determine the device's performance under vibration. Additionally, consider using a vibration-resistant mounting method, such as a screw-down or adhesive mounting, to ensure the device remains secure.
  • To troubleshoot issues with TCTOP1A106M8R, start by reviewing the device's datasheet and application notes. Check for proper PCB layout, component selection, and soldering quality. Use a multimeter or an oscilloscope to measure the device's electrical characteristics and identify any anomalies. If the issue persists, contact ROHM Semiconductor's technical support team for further assistance.

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