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TD310IDT - STMicroelectronics

Description: Triple IGBT/MOS driver with current sense

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TD310IDT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-16*--0
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TD310IDT Details

  • Manufacturer Part Number:

    TD310IDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    MICRO, PLASTIC, SO-16

  • Pin Count:

    16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.6 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    16 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.4 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    3.9 mm

TD310IDT Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management.
  • To optimize thermal performance, ensure good thermal conduction between the device and the PCB, use a thermal pad or heat sink, and avoid blocking airflow around the device. Refer to the thermal management section in the datasheet for more information.
  • The maximum operating frequency of the TD310IDT is 100 MHz, but it can be overclocked up to 150 MHz with proper thermal management and power supply design.
  • The TD310IDT requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is VCC, then VDD, and finally AVDD. Refer to the power management section in the datasheet for more information.
  • STMicroelectronics recommends using a decoupling capacitor configuration with a 10 uF capacitor on the VCC pin, a 4.7 uF capacitor on the VDD pin, and a 1 uF capacitor on the AVDD pin. Refer to the application note AN5323 for more information.

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TD310IDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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