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TDA7309 - STMicroelectronics

Description: IC AUDIO SIGNAL PROCESSOR 20DIP

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TDA7309 - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP20
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TDA7309 - STMicroelectronics  - 3D model - Dual-In-Line Packages - DIP20
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TDA7309 Details

  • Manufacturer Part Number:

    TDA7309

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DIP

  • Package Description:

    DIP-20

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    3

  • Channel Separation:

    100 dB

  • Consumer IC Type:

    VOLUME CONTROL CIRCUIT

  • Harmonic Distortion:

    0.01%

  • JESD-30 Code:

    R-PDIP-T20

  • JESD-609 Code:

    e3

  • Length:

    25.15 mm

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.93 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

TDA7309 Frequently Asked Questions (FAQs)

  • A 10uF capacitor in parallel with a 100nF capacitor is recommended for power supply decoupling to ensure stable operation and minimize noise.
  • The gain of the TDA7309 can be configured by connecting a resistor (Rg) between the gain pin (GAIN) and ground. The gain is calculated as 20 dB + 20 dB/Rg (in kΩ).
  • The maximum power dissipation of the TDA7309 is 2.5 W, and it is recommended to keep the junction temperature below 150°C to ensure reliable operation.
  • No, the TDA7309 is not designed to be used as a bridge amplifier. It is a single-ended amplifier and should be used in a single-ended configuration.
  • The TDA7309 has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, it is recommended to add external protection circuits, such as a voltage regulator and a crowbar circuit, to ensure reliable operation.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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