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TDA8035HN/C1/S1J - NXP

Description: High integrated and low power smart card interface

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Symbol
TDA8035HN/C1/S1J - NXP - PCB symbol
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PCB Footprints
TDA8035HN/C1/S1J - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN32(1)
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3D Models
TDA8035HN/C1/S1J - NXP - 3D model - Quad Flat No-Lead - HVQFN32(1)
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TDA8035HN/C1/S1J Details

  • Manufacturer Part Number:

    TDA8035HN/C1/S1J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT617-7

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TDA8035HN/C1/S1J Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8035HN/C1/S1J involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, the layout should minimize the length of the traces and avoid crossing analog and digital signals.
  • To ensure proper powering and decoupling of the TDA8035HN/C1/S1J, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 100nF and 10uF) close to the device's power pins. Also, ensure that the power supply can provide the required current.
  • The TDA8035HN/C1/S1J has an operating temperature range of -40°C to 125°C. However, the device's performance may degrade at extreme temperatures, so it's essential to ensure proper thermal management and heat dissipation.
  • To troubleshoot issues with the TDA8035HN/C1/S1J, start by checking the power supply, decoupling, and PCB layout. Verify that the device is properly configured and that the input signals are within the specified range. Use oscilloscopes and logic analyzers to debug the device's behavior and identify potential issues.
  • The TDA8035HN/C1/S1J is a high-reliability device, but it's essential to follow NXP's guidelines for using the device in safety-critical applications. Ensure that you comply with relevant industry standards, and perform thorough testing and validation to ensure the device meets the required safety and reliability standards.

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TDA8035HN/C1/S1J Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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