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TDA8035HN/C2/S1J - NXP

Description: Smart Card Interface ICs High integrated and low power smart card interface ,2.7V ~ 5.5V ,300 mV ,65MA ,-25 - +85 ?C

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Symbol
TDA8035HN/C2/S1J - NXP - PCB symbol
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PCB Footprints
TDA8035HN/C2/S1J - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT617-7
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3D Models
TDA8035HN/C2/S1J - NXP - 3D model - Quad Flat No-Lead - SOT617-7
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TDA8035HN/C2/S1J Details

  • Manufacturer Part Number:

    TDA8035HN/C2/S1J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT617-7

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

TDA8035HN/C2/S1J Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8035HN/C2/S1J involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, the input and output tracks should be kept short and away from noise sources.
  • To ensure proper powering and decoupling of the TDA8035HN/C2/S1J, use a high-quality power supply with low ripple and noise, and add decoupling capacitors (e.g., 100nF and 10uF) close to the device's power pins. Also, ensure the power supply can provide the required current.
  • For thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the underside of the package. Also, keep the device away from heat sources and ensure the PCB is designed to dissipate heat efficiently.
  • To troubleshoot issues with the TDA8035HN/C2/S1J, start by checking the power supply and decoupling, then verify the input and output connections. Use an oscilloscope to check the signals and ensure they are within the specified ranges. Consult the datasheet and application notes for guidance on specific issues.
  • Yes, the TDA8035HN/C2/S1J is sensitive to electrostatic discharge (ESD). Handle the device in an ESD-protected environment, use ESD-protected workbenches and tools, and ensure personnel are grounded before handling the device.

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TDA8035HN/C2/S1J Overview

Use the download button to access the TDA8035HN/C2/S1J schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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