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TDA8551T/N1,112 - NXP

Description: NXP TDA8551T/N1,112 Audio Amplifier, Class-AB Mono, 8-Pin SOIC

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TDA8551T/N1,112 - NXP - PCB symbol
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PCB Footprints
TDA8551T/N1,112 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO8
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3D Models
TDA8551T/N1,112 - NXP - 3D model - Small Outline Packages - SO8
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TDA8551T/N1,112 Details

  • Manufacturer Part Number:

    TDA8551T/N1,112

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT96-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Consumer IC Type:

    VOLUME CONTROL CIRCUIT

  • Harmonic Distortion:

    0.15%

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TDA8551T/N1,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8551T/N1,112 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, ensure that the input and output tracks are short and direct, and that the device is decoupled from the power supply using capacitors.
  • To ensure EMC with the TDA8551T/N1,112, follow proper PCB design guidelines, use a metal shield around the device, and ensure that the device is properly decoupled from the power supply. Additionally, use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • The TDA8551T/N1,112 has an operating temperature range of -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • Yes, the TDA8551T/N1,112 is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • To troubleshoot issues with the TDA8551T/N1,112, start by checking the power supply voltage, ensuring that it's within the recommended range. Then, verify that the input and output signals are correct, and check for any signs of overheating or physical damage. Use an oscilloscope to analyze the signals and identify any anomalies.

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TDA8551T/N1,112 Overview

Use the download button to access the TDA8551T/N1,112 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA85, or try a keyword search, such as Audio Control ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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