TDA8552TS/N1 footprint, schematic symbol and 3D model by NXP

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PCB Footprints

TDA8552TS/N1 - NXP PCB footprint - Other - Other - SOT266-1_2022

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Part Number TDA8552TS/N1
Manufacturer NXP
Pin Count 20
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - SOT266-1_2022
Released Date Aug 16, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

TDA8552TS/N1 Details

Manufacturer Part Number:
TDA8552TS/N1
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
SSOP
Package Description:
LSSOP,
Pin Count:
20
Reach Compliance Code:
Unknown
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
NXP Semiconductors
YTEOL:
0
Channel Separation:
55 dB
Consumer IC Type:
VOLUME CONTROL CIRCUIT
Harmonic Distortion:
0.1%
JESD-30 Code:
R-PDSO-G20
JESD-609 Code:
e4
Length:
6.5 mm
Moisture Sensitivity Level:
1
Number of Channels:
2
Number of Functions:
1
Number of Terminals:
20
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
LSSOP
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
Seated Height-Max:
1.5 mm
Supply Current-Max:
20 mA
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
2.7 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
4.4 mm

TDA8552TS/N1 Frequently Asked Questions (FAQs)

A good PCB layout for the TDA8552TS/N1 should ensure that the analog and digital grounds are separated, and the analog ground should be connected to the digital ground at a single point. Additionally, the power supply lines should be decoupled with capacitors, and the input and output tracks should be kept as short as possible to minimize noise and interference.
To ensure the TDA8552TS/N1 operates within its recommended operating conditions, the supply voltage should be kept within the range of 2.7V to 5.5V, and the junction temperature should be kept below 150°C. Additionally, the device should be operated within its recommended frequency range, and the input signals should be within the specified voltage range.
The recommended method for powering up and powering down the TDA8552TS/N1 is to use a slow ramp-up and ramp-down of the supply voltage to prevent damage to the device. The power-up sequence should be such that the analog supply voltage is applied before the digital supply voltage, and the power-down sequence should be the reverse.
To troubleshoot issues with the TDA8552TS/N1, start by checking the power supply voltage and ensuring it is within the recommended range. Then, check the input and output signals to ensure they are within the specified voltage range. If the issue persists, check the PCB layout for any errors or noise coupling, and verify that the device is operated within its recommended frequency range.
The TDA8552TS/N1 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, the device should be mounted on a PCB with a good thermal conductivity, and the ambient temperature should be kept below 85°C to prevent overheating.

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TDA8552TS/N1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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