TDC-GP30-F01 - ScioSense

TDC-GP30-F01 Details

• Manufacturer Part Number:

  TDC-GP30-F01

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Contact Manufacturer

• Package Description:

  QFN-32

• HTS Code:

  8542.31.00.30

• Manufacturer:

  ScioSense

• Additional Feature:

  IT AS AVAILABLE IN QFN-40

• JESD-30 Code:

  S-XQCC-N32

• Length:

  5 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  32

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  UNSPECIFIED

• Package Code:

  HVQCCN

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1 mm

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  2.5 V

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  10

• Width:

  5 mm

• uPs/uCs/Peripheral ICs Type:

  SoC