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TDE3247FPT - STMicroelectronics

Description: Interface circuit (relay and lamp driver)

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TDE3247FPT - STMicroelectronics - PCB symbol
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TDE3247FPT - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-14_2022
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TDE3247FPT Details

  • Manufacturer Part Number:

    TDE3247FPT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Built-in Protections:

    THERMAL; SHORTCIRCUIT

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.65 mm

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.25 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    30 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

TDE3247FPT Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Although the datasheet specifies the recommended operating conditions, it's essential to note that the maximum allowed voltage on the input pins is typically 5.5V, which is higher than the recommended VCC of 3.3V or 5V. However, it's crucial to ensure that the input voltage does not exceed the maximum rating to prevent damage to the device.
  • To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and assembly procedures. Use ESD-protective packaging, wrist straps, and mats, and ensure that all equipment is properly grounded. Avoid touching the device's pins or exposing them to static-prone environments.
  • STMicroelectronics recommends soldering the TDE3247FPT using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 30 seconds. Hand soldering is not recommended due to the device's small size and high pin count.

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TDE3247FPT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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